From optical transceiver PCBA manufacturing to advanced packaging capabilities (CPO/SiPh/Flip-Chip), FICG ( also known as PRIME Technology) supports partners in building and scaling AI optical fabric architectures for next-generation data centers. By continuously expanding our manufacturing, assembly, and reliability capabilities, we help shorten development cycles, accelerate qualification readiness, and enable scalable mass production with consistent performance.
In 2026, FICG will participate in OFC in Los Angeles, where we will highlight our end-to-end manufacturing and packaging capabilities for high-speed optical transceivers. Our portfolio addresses the growing demands of high-speed data transmission and AI optical fabric architectures across development, qualification, and mass production stages.
Advanced Packaging
High-Density PCBA Assembly
Addressing the integration requirements of high-density, low-power optical engines, we leverage high-density PCBA SMT and precision assembly capabilities to enable manufacturing readiness across CPO, Silicon Photonics (SiPh), and Flip-Chip packaging paths at both design-in and volume introduction stages. Through early-stage process planning and assembly configuration, we help partners address manufacturability and production scalability from the outset, reduce integration risk, and accelerate the transition from development validation to volume ramp and scalable production. These capabilities support the growing demands for high-speed transmission and high-density deployment in AI-driven data center architectures.
Manufacturing & Reliability Capabilities
With manufacturing excellence and reliability as core priorities, we strengthen process control, quality consistency, and reliability validation to help partners accelerate product qualification and introduction timelines. Through established quality management systems and disciplined process control practices, we reduce risks associated with the transition from development to volume production, improve yield stability and build consistency, and support scalable high-volume manufacturing. These capabilities ensure long-term reliability and stable performance under high-bandwidth, high-load operating conditions for AI-driven data center applications.
Visitor Information
Exhibition: 2026 OFC (Optical Fiber Communication Conference and Exposition)
Date: March 17–19, 2026
Venue: Los Angeles Convention Center | Los Angeles, California, United States
(1201 South Figueroa Street Los Angeles, California 90015, United States)
Booth No.: South Hall, #2463
Visitor Registration: https://www.ofcconference.org/registration/
Visit us at South Hall, Booth 2463, or fill out the contact us form (Click Here) to arrange a discussion in advance.