FICG Participates 2026 OFC In Los Angeles
From optical transceiver PCBA manufacturing to advanced […]
COB Technology: The Future of Compact Electronics
COB (Chip on Board) powers compact, efficient electronics with better signal integrity and speed, and serves as a key packaging technology supporting FICG’s expertise in optical modules and CPO integration.
Flip Chip and Flip Chip Package Technology
Flip chip packaging explained: structure, bumps, substrates, assembly, choosing tips, and how FICG's copper-pillar, lead-free tech boosts performance.
Surface Mount Technology (SMT): Process Overview and Choosing the Right Assembly Type
FICG’s SMT manufacturing process delivers precision, reliability, and scalability for high-speed optical modules, powering next-gen data centers, 5G, and AI infrastructure with best-in-class PCB assembly.
Optical Transceiver: 400G, 800G, 1.6T and the Leap to 3.2T and Beyond
Learn how 400G, 800G, 1.6T, and 3.2T optical transceivers—powered by silicon photonics and CPO—are updating AI, cloud, and hyperscale networks.