Since 2008, we have been deeply engaged in the optical communication industry, specializing in PCBA manufacturing for optical transceivers. We have established a comprehensive product line that spans from entry-level to ultra-high-speed solutions. Starting with foundational modules such as SFP, SFF, and XFP, our development has advanced to today’s 400G, 800G and 1.6T, and we are actively moving toward next-generation high-speed modules like 3.2T. Our offerings fully cover a wide range of form factors including CFP, SFP+, QSFP28, QSFP56, OSFP, TXFP, QSFP-DD, and OSFP.
Our product technologies continue to evolve with market demands, progressing from early-stage technologies such as 1G and 2G to today’s ultra-high-speed solutions like 800G and even 1.6T. This demonstrates our strong expertise and forward-looking positioning in the field of high-speed optical transceivers.
Optical communication technology is rapidly becoming the driving force behind next-generation high-speed data transmission. With the rise of cloud computing and big data applications, global data traffic is experiencing explosive growth, further fueling the surging demand for high-speed optical transceivers in data centers. High-speed optical transceivers ranging from 400G and 800G to 1.6T are increasingly being commercialized, becoming indispensable components in cloud servers, AI training platforms, and high-performance computing (HPC) architectures.
In particular, for AI applications such as large language models, distributed computing architectures rely heavily on high-bandwidth, low-latency interconnect solutions. Optical transceivers enable stable, high-speed data transmission of up to 1.6T between nodes, effectively supporting the rapid scheduling and processing of massive data volumes.
Looking ahead, optical transceivers will evolve toward, lower power consumption and higher integration density to meet the stringent requirements of AI-driven platforms for high performance, energy efficiency, and scalability. Optical transceiver solutions that offer high reliability and advanced manufacturing capabilities will be a critical driving force in building the next generation of intelligent infrastructure.
In the early stage of 2008, our product offerings included 1.25G SFF and 2G Copper modules, establishing the foundation for low-speed module manufacturing. By 2010, we launched 2G/4G SFP products, gradually reinforcing our capabilities in this segment. In 2012, we further expanded into modules with the introduction of 8G SFP, 10G SFP/XFP, 40G Q-WIRE, and 40G QSFP SR4, along with support for 10G SNAP12, EPON, and GPON applications.
From 2014, we entered the high-speed module segment step by step, launching 10G CXP Gen1, 25G SFP28, 40G QSFP+, 100G C-Wire, 100G CFP/CFP2, and 100G Topaz modules—marking our entry into the 100G era. By 2016, we advanced further with the development of 50G SFP56 PAM4, and achieved commercialization of 100G QSFP28 LR4 CWDM and 400G QSFP-DD DR4/SR8 modules, extending our reach to 400G applications.
In 2018, we continued refining our 400G product lines, launching solutions such as 100G CFP2-ACO, 200G QSFP56, and 400G QSFP-DD FR4/CFP8, supporting diverse high-speed switching and optical transport architectures.
From 2020 to 2022, our product upgrades focused on OSFP packaging and 800G transmission technologies. This included the release of OSFP 200G/400G modules, 800G OSFP/OSFP-DD (Flip Chip), and 800G QSFP-DD, designed to meet the increasing data demands of data centers and high-performance computing (HPC).
Starting in 2023, we introduced the 800G OSFP TRO/LRO (Flip Chip) and officially initiated the development and commercialization of 1.6T OSFP Siph (Flip Chip) modules. This was followed by the launch of the 1.6T OSFP TRO Siph and 1.6T OSFP Siph (Normal) series, demonstrating our comprehensive technical achievement and strategic deployment in the optical module industry.
Starting from early electrical core packaging (SFF/Copper), we have progressively advanced to BGA and LGA packaging technologies, and further applied flip chip packaging to support the higher bandwidth requirements of 800G and 1.6T modules. We are also actively developing co-packaged optics (CPO) technology, integrating DSPs, LD, Driver ICs, and Silicon Photonics (SiPh) chips into a single module, targeting 3.2T high-speed transmission capabilities. Innovations include co-packaging, multi-chip integration, and LPO/SiPh technologies, ensuring shorter signal paths, better thermal management, and superior electrical performance. Our precision manufacturing supports the smallest 008004 components, and we offer customized solutions tailored to diverse application needs. Through technological innovation and product expansion, we are committed to meeting the rigorous demands for high speed, low latency, high stability, and efficiency in AI, big data, and cloud computing applications.
We possess a range of industry-leading advanced manufacturing and automation technologies that fully support the production demands of next-generation high-speed optical transceivers, from micro-component placement to high-density packaging:
– Ultra-miniature component placement technology (supports 01005 and 0201 components)
– Minimum supported component size down to 008004 (0.25 × 0.125 mm)
– Chip-on-Board (COB) encapsulation and protection processes
– High-density packaging processes (e.g., 37030 LGA)
– Design and mass production capabilities for rigid-flex PCB assemblies
– BGA underfill, component encapsulation, and conformal coating
– Flip Chip packaging technology for bare dies, supporting 100 µm pitch and ultra-fine pitch of 110–150 µm
– A complete process chain covering SMT, wire bonding (W/B), and packaging (Underfill, glob-top)
To meet the stringent requirements for reliability and consistency in high-speed optical transceivers, we have implemented a comprehensive quality management system and traceability framework to ensure high-quality manufacturing:
– Deployment of automated inspection systems, including AOI (Automated Optical Inspection), SPI (Solder Paste Inspection), and X-Ray
– Full-process electrical testing and validation to guarantee production quality
– Integration with MES (Manufacturing Execution System) for real-time traceability and process monitoring
– Proven rework capabilities, supporting repairs at micro-component levels such as 008004
– Widely applied in high-speed optical modules, with over 100 implementations involving copper-tungsten component placement
– Achieved stable mass production of 100G to 800G modules and actively advancing 1.6T series into the manufacturing stage
Quality control practices and integrated technologies reflect our strong expertise in advanced optical transceiver manufacturing and our long-term commitment to reliability.
– 1/4-channel full-duplex optical transceiver modules
– Compliant with SFP28 / SFP56 / QSFP+ specifications
– Supports transmission rates up to 10.3125 Gbps to 53.125 Gbps
– EEPROM writable for coding configuration
– 1/4-channel full-duplex optical transceiver modules
– Compliant with QSFP28 / SFP-DD / SFP112 MSA specifications
– Adheres to CMIS, SFF-8636, and SFF-8665 standards
– Supports transmission rates up to 103.125 Gbps / 106.25 Gbps
– EEPROM writable for coding configuration
– 4/8-channel full-duplex optical transceiver modules
– Compliant with QSFP56 / QSFP-DD MSA specifications
– Adheres to CMIS, SFF-8636, and SFF-8665 standards
– Supports transmission rates up to 206.25 Gbps to 212.5 Gbps
– EEPROM writable for coding configuration
– 4/8-channel full-duplex optical transceiver modules
– Compliant with QSFP-DD / QSFP112 / OSFP MSA specifications
– Adheres to CMIS, SFF-8636, and SFF-8665 standards
– Supports transmission rates up to 425 Gbps
– EEPROM writable for coding configuration
– 8-channel full-duplex optical transceiver modules
– Compliant with OSFP / QSFP-DD MSA specifications
– Adheres to CMIS, SFF-8636, and SFF-8665 standards
– Supports transmission rates up to 850 Gbps
– EEPROM writable for coding configuration
– 8-channel full-duplex optical transceiver modules
– Compliant with QSFP-DD / OSFP / OSFP-XD MSA specifications
– Adheres to CMIS, SFF-8636, and SFF-8665 standards
– Supports transmission rates up to 1.6 Tbps
– EEPROM writable for coding configuration
To adapt to the rapidly changing global market demands, we have established multiple production sites to build a flexible and scalable supply system. Through localized supply chain integration, smart warehousing, and cross-regional collaborative production processes, we have significantly improved lead time flexibility and risk management capabilities. Our system supports stable high-volume deliveries while maintaining flexibility for High-Mix, Low-Volume(HMLV), meeting industries’ expectations for high-quality and reliable supply, thus demonstrating our overall global service competitiveness.
As the global AI wave accelerates, demand for high-speed, high-capacity data transmission continues to surge across data centers, high-performance computing (HPC), and network infrastructure. In response, we are actively advancing our deployment of next-generation optical communication technologies.
Building on our foundation in optical transceiver PCBA manufacturing, we are steadily deepening our process capabilities and expanding technological breadth.
Starting from SMT assembly to meet the requirements of high integration and precision manufacturing, we have further extended our capabilities into optical transceivers COB (Chip-on-Board) packaging. Step by step, we are constructing a fully integrated manufacturing chain—from chip-level processes to complete module assembly.
Through continuous technological innovation and rigorous quality control. Our capabilities have earned the long-term trust and collaboration of several leading international optical module companies, positioning us as a highly reliable and strategic supply partner in the industry.
As application scenarios continue to diversify, we are extending optical communication technology beyond traditional data centers and telecom networks into advanced fields such as autonomous driving and smart cities. This expansion highlights our ability to integrate foundational manufacturing processes with future-ready technologies, driving key momentum for the global development of high-speed communication.
